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1 |
Matrix-based memory efficient symmetric key generation and pre-distribution scheme for wireless sensor networks |
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2 |
Optimised priority assignment mechanism for biomedical wireless sensor networks |
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3 |
Coverage analysis and active scheme of wireless sensor networks |
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4 |
Co-operative routing for wireless sensor networks using network coding |
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Online tracking of coherent signals over multiple-input multiple-output code division multiple access communication channel using JADE-capon method in conjunction with iterative space??time lifting preprocessing scheme |
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6 |
New channel path loss model for near-ground antenna sensor networks |
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7 |
Reliable and energy-efficient cooperative routing algorithm for wireless monitoring systems |
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8 |
Low memory visual saliency architecture for data reduction in wireless sensor networks |
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9 |
Energy-efficient signal acquisition in wireless sensor networks: a compressive sensing framework |
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10 |
On localisation accuracy inside the human abdomen region |
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11 |
Design of solar photovoltaic micro-power supply for application of wireless sensor nodes in complex illumination environments |
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12 |
Interference aware power controlled forwarding for lifetime maximisation of wireless ad hoc networks |
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13 |
New optimal solution to disjoint set K-coverage for lifetime extension in wireless sensor networks |
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14 |
OPEN: An optimisation scheme of N-node coverage in wireless sensor networks |
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15 |
Nodes self-scheduling approach for maximising wireless sensor network lifetime based on remaining energy |
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16 |
Distributed geographical packet forwarding in wireless sensor and actuator networks - a stochastic optimal control approach |
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17 |
Reliable Operation for 14500 h of a Wavelength-Stabilized Diode Laser System on a Microoptical Bench at 671 nm |
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18 |
Ultracompact UHF Tunable Filter Embedded Into Multilayered Organic Packaging Substrate |
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19 |
Reduction of Thermal Resistance of High-Power Amplifiers by Carbon Fiber-Reinforced Carbon Composite-Based Package |
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20 |
High Density Metal–Metal Interconnect Bonding for 3-D Integration |
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21 |
Novel Chip-Last Method for Embedded Actives in Organic Packaging Substrates |
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22 |
Impact of the Surface Roughness Description on the Electrical Contact Resistance of Ohmic Switches Under Low Actuation Forces |
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23 |
Optimization of Phase Change Material Heat Sinks for Low Duty Cycle High Peak Load Power Supplies |
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24 |
Integrated Transformer-Coupled Balun Bandpass Filters With an Optimal Common-Mode Rejection Ratio |
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25 |
Affect of Anneal Temperature on All-Copper Flip-Chip Connections Formed via Electroless Copper Deposition |
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