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1 |
Experimental Validation of Charge-Sensitive Amplifier Configuration that Compensates for Detector Capacitance |
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2 |
Identification of Oil–Water Flow Patterns in a Vertical Well Using a Dual-Ring Conductance Probe Array |
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3 |
Equipment Failure Characteristics and RCM for Optimizing Maintenance Cost |
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4 |
Three-Level NPC-Inverter-Based SVM-VCIMD With Feedforward Active PFC Rectifier for Enhanced AC Mains Power Quality |
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5 |
A Manifold Alignment Approach for Hyperspectral Image Visualization With Natural Color |
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6 |
Fast and Provably Accurate Bilateral Filtering |
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7 |
Preaggregation Functions: Construction and an Application |
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8 |
Control and suppression of impulse surface flashover in vacuum based on discharge development mechanisms |
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9 |
Optimizing Air-Core Permanent-Magnet-Based Energy Harvest in Free-Rotating Devices |
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10 |
A model and regularization scheme for ultrasonic beamforming clutter reduction |
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11 |
Educational Virtual-Wear Trial: More Than a Virtual Try-On Experience |
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12 |
Nonintrusive On-Line Transition-Time Binning and Timing Failure Threat Detection for Die-to-Die Interconnects |
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13 |
Internet of Things: A Survey on Enabling Technologies, Protocols, and Applications |
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14 |
Data Remapping for Static NUCA in Degradable Chip Multiprocessors |
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15 |
Modeling and Simulation of Low-Frequency Noise in Nano Devices: Stochastically Correct and Carefully Crafted Numerical Techniques |
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16 |
Intelligent Patient Management and Resource Planning for Complex, Heterogeneous, and Stochastic Healthcare Systems |
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17 |
Effects of Polishing Parameters on Evolution of Different Wafer Patterns During Cu CMP |
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18 |
Fault Detection Using Random Projections and k-Nearest Neighbor Rule for Semiconductor Manufacturing Processes |
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19 |
Statistical Comparison of Fault Detection Models for Semiconductor Manufacturing Processes |
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20 |
Optimization of the Optical Whiteness Ratio for Flexible Display by Using Taguchi's Dynamic Approach |
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21 |
Transport Phenomena in a Novel Large MOCVD Reactor for Epitaxial Growth of GaN Thin Films |
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22 |
Analyzing UV/Vis/NIR Spectra-Sputtered ZnO:Al Thin-Films III: Plasma-Parameter Dep. |
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23 |
A Comparative Study of Metamodels for Fast and Accurate Simulation of Nano-CMOS Circuits |
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24 |
Adhesion of Contaminant Particles to Advanced Photomask Materials |
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25 |
GA Guided Cluster Based Fuzzy Decision Tree for Reactive Ion Etching Modeling: A Data Mining Approach |
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26 |
Estimating the Process Yield of Multiple Characteristics With One-Sided Specifications |
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27 |
Cost of Ownership/Yield Enhancement of High Volume Immersion Lithography Using Topcoat-Less Resists |
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28 |
Spatiotemporal Pattern Modeling for Fault Detection and Classification in Semiconductor Manufacturing |
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29 |
Fault Detection and Classification in Plasma Etch Equipment for Semiconductor Manufacturing -Diagnostics |
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30 |
Global and Local Virtual Metrology Models for a Plasma Etch Process |
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31 |
An Experimental Comparison of Production Planning Using Clearing Functions and Iterative Linear Programming-Simulation Algorithms |
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32 |
Discovering Correlated Parameters in Semiconductor Manufacturing Processes: A Data Mining Approach |
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33 |
Special issue on advanced modeling of power devicesand their applications |
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34 |
Enabling Scatterometry as an In-Line Measurement Technique for 32 nm BEOL Application |
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35 |
Max Separation Clustering for Feature Extraction From Optical Emission Spectroscopy Data |
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36 |
Metrology Sampling Strategies for Process Monitoring Applications |
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37 |
Nonlinear Sequential Bayesian Analysis-Based Decision Making for End-Point Detection of Chemical Mechanical Planarization (CMP) Processes |
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38 |
Physical Model for the Small-Scale Residual Topography in Chemical Mechanical Polishing |
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39 |
Spectral Evidence of Si Complexes in HVPE-Grown GaAs |
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40 |
Study of Bubble Activity in a Megasonic Field Using an Electrochemical Technique |
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41 |
Uniform, Low-Resistive Ni-Pt Silicide Fabricated by Partial Conversion With Low Metal-Consumption Ratio |
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42 |
Voltage and Temperature-Aware SSTA Using Neural Network Delay Model |
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43 |
Wafer Surface Charging Model for Single-Wafer Wet-Spin Processes |
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