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  3. Device and Materials Reliability
  4. High Gamma Value 3D-Stackable HK/MG-Stacked Tri-Gate Nanowire Poly-Si FETs With Embedded Source/Drain and Back Gate Using Low Thermal Budget Green Nanosecond Laser Crystallization Technology
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Category: Device and Materials Reliability
By MTech Projects
MTech Projects
15.May
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High Gamma Value 3D-Stackable HK/MG-Stacked Tri-Gate Nanowire Poly-Si FETs With Embedded Source/Drain and Back Gate Using Low Thermal Budget Green Nanosecond Laser Crystallization Technology

PROJECT TITLE :

High Gamma Value 3D-Stackable HK/MG-Stacked Tri-Gate Nanowire Poly-Si FETs With Embedded Source/Drain and Back Gate Using Low Thermal Budget Green Nanosecond Laser Crystallization Technology

ABSTRACT:

3-dimensional sequentially stackable high- $k$ /metal-gate-stacked tri-gate nanowire poly-Si FETs with embedded supply/drain (e-S/D) and back gate were demonstrated. The highly crystallized channel, fabricated by inexperienced nanosecond laser crystallization, chemical mechanical polish, and postsurface modification processes, enhances the electrical property of the tri-gate nanowire FET. The e-S/D structure reduces the contact and series resistances caused by the nanowire structure. Thus, the fabricated n/p-kind tri-gate nanowire poly-Si FETs exhibit steep subthreshold swings (96/125 mV/decade), high ON-currents (232/110 $mu textA/mu textm$ ), and $I_mathrmscriptscriptstyle on/I_mathrmscriptscriptstyle OFF$ ratio ( $> 10^5)$ . Furthermore, the freelance back gate with skinny back gate oxide can easily adjust the edge voltage of the tri-gate nanowire transistor and leads to high gamma value (>zero.05) FET realizing sequentially stacked and low $V_mathrm dd$ (0.vi V) operable inverter.

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