PROJECT TITLE :

In Situ Platform for Isothermal Testing of Thin-Film Mechanical Properties Using Thermal Actuators

ABSTRACT:

An in situ tensile check platform has been developed to review the mechanical properties of thin-film metal specimens. The fully integrated on-chip platform loads a specimen using a thermal actuator (TA). TAs conveniently provide high forces and wonderful alignment, but generate giant heat that may flow to specimens and lift their temperature. Within the new style, heat flow to the specimen is negligible. This attribute was achieved by introducing a thermal resistor that limits heat flow to the specimen and a heat sink that shunts the remaining heat. Tensile residual stress in the specimen was eliminated by as well as preinserted microgrippers. A comprehensive error analysis indicates that the strength accuracy is ±five% (one normal deviation). The platform was used to check the strength-connected mechanical properties of Al/0.5 wt% Cu microtensile bars with two different thicknesses. Initial tests indicate that zero.63- $mu textm$ -thick tensile bars exhibit higher strength, a bigger strain hardening coefficient, and fewer elongation than one.03- $mu textm$ -thick tensile bars. Transmission electron microscopy indicated that the lower ductility was due to plastic strain localization. When the tensile bar length is decreased from two hundred to 70 or 50 $mu textm$ , strength increased by 40% for each thickness values. [2015-0082]