ABSTRACT:

In this paper, we describe the first- and second-level system packaging structure of the IBM zEnterprise® 196 (z196) enterprise-class server. The design point required a more than 50% overall increase in system performance (in millions of instructions per second) in comparison to its predecessor. This resulted in a new system design that includes, among other things, increased input/output bandwidth, more processors with higher frequencies, and increased current demand of more than 2,000 A for the six processor chips and two cache chips per multichip module. To achieve these targets, we implemented several new packaging technologies. The z196 enterprise-class server uses a new differential memory interface between the processor chips and custom-designed server memory modules. The electrical power delivery system design follows a substantially new approach using Vicor Factor Power® blocks, which results in higher packaging integration density and minimized package electrical losses. The power noise decoupling strategy was changed because of the availability of deep-trench technology on the new processor chip generation.