JA Purity IV
  • HOME
    • Business
    • Corporate
    • Logistics
    • Product
    • News / Magazine
  • MTECH PROJECTS
    • COMPUTER SCIENCE
      • MTech Python Projects
        • Machine Learning Projects
        • Deep Learning Projects
        • Blockchain Projects
        • django Projects
      • MTech Java Projects
        • Cloud Computing Projects
        • Data Mining Projects
        • Mobile Computing Projects
        • Networking Projects
      • MTech NS2 Projects
        • Wireless Communication Projects
        • Vehicular Technology Projects
      • MTech Hadoop Projects
      • MTech Android Projects
    • ELECTRONICS
      • MTech DSP Projects
      • MTech DIP Projects
      • MTech VLSI Projects
      • MTech Communication Projects
    • ELECTRICAL
      • MTech Power Systems Projects
      • MTech Power Electronics Projects
      • MTech Control Systems Projects
    • OTHER
      • Chemical Projects
      • Mechanical Projects
      • All Other Projects
  • EMBEDDED KITS
    • MTech Embedded Kits
    • BTech Embedded Kits
  • PROJECTS+
  • PUBLISHING
    • Research Publishing
    • Authors Guidelines
    • Publishing Policy
  • CONTACT US

Contact Us

  • 4517 Washington Ave. Manchester, Kentucky 39495
  • (201) 555-0124
  • hello@purityiv.com

Welcome to MTech Projects - Online Projects for MTech Students

  • My Account
  • Careers
  • Downloads
  • Blog
JA Purity IV
  • Email Us
  • Phone Number
  • Open Hours
  • HOME
    • Business
    • Corporate
    • Logistics
    • Product
    • News / Magazine
  • MTECH PROJECTS

    MTech Python Projects

    • Machine Learning Projects
    • Deep Learning Projects
    • Blockchain Projects
    • django Projects

    MTECH JAVA PROJECTS

    • Cloud Computing Projects
    • Data Mining Projects
    • Mobile Computing Projects
    • Networking Projects

    MTECH NS2 PROJECTS

    • Wireless Communication Projects
    • Vehicular Technology Projects
    • MTech Hadoop Projects
    • MTech Android Projects

    ELECTRONICS

    • MTech DSP Projects
    • MTech DIP Projects
    • MTech VLSI Projects
    • MTech Communication Projects

    ELECTRICAL

    • MTech Power Systems Projects
    • MTech Power Electronics Projects
    • MTech Control Systems Projects

    OTHER

    • Chemical Projects
    • Mechanical Projects
    • All Other Projects
  • EMBEDDED KITS
    • MTech Embedded Kits
    • BTech Embedded Kits
  • PROJECTS+
  • PUBLISHING
    • Research Publishing
    • Authors Guidelines
    • Publishing Policy
  • CONTACT US

Project Enquiry

  1. You are here:  
  2. Home
  3. Device and Materials Reliability
  4. Nb-Doped $hbox_hbox_ $ as Charge-Trapping Layer for Nonvolatile Memory Applications
Details
Category: Device and Materials Reliability
By MTech Projects
MTech Projects
08.Mar
Hits: 1

Nb-Doped $hbox_hbox_ $ as Charge-Trapping Layer for Nonvolatile Memory Applications

PROJECT TITLE :

Nb-Doped $hbox_hbox_ $ as Charge-Trapping Layer for Nonvolatile Memory Applications

ABSTRACT:

Charge-trapping properties of Nb-doped $hbox{La}_{2}hbox{O}_{3}$ (LaNbO) are investigated using an $hbox{Al/Al}_{2}hbox{O}_{3}/hbox{LaNbO/SiO}_{2}/hbox{Si} $ structure. Compared with the memory device with $hbox{La}_{2}hbox{O}_{3} $, the one with LaNbO shows better charge-trapping characteristics, including larger memory window (6.0 V at $pm hbox{16} $ V sweeping voltage), higher programming speed (9.1 V at $+hbox{16} $ V for 1 ms), and better retention property (94% charge retained after $hbox{10}^{4}$ s at $hbox{120} ^{circ}hboxDevice and Materials Reliability $) , due to its higher trapping efficiency resulted from increased trap density and suppressed formation of a silicate interlayer at the $hbox{LaNbO/SiO}_{2} $ interface by the Nb doping. Therefore, LaNbO is a promising candidate as the charge-trapping layer for nonvolatile memory applications.

Did you like this research project?

To get this research project Guidelines, Training and Code... Click Here

Previous article: Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits Next article: Test and Repair Methodology for FinFET-Based Memories Test and Repair Methodology for FinFET-Based Memories
COMPUTER SCIENCE PROJECTS ELECTRONICS PROJECTS ELECTRICAL PROJECTS EMBEDDED PROJECTS MECHANICAL PROJECTS

sell academic m.tech, btech and be projects online

sell academic m.tech, btech and be projects online

Academic Final Year Projects

QUICK LINKS

  • Python Projects for Beginners
  • Java Projects for Beginners
  • Android Projects for Beginners
  • IEEE Transactions on Signal Processing
  • Image Processing Techniques
  • IEEE VLSI Projects
  • Power System Projects for EEE
  • Power Electronics Based Projects
SUPPORT
+91 9573777164
9:00am - 6:00pm IST
info@mtechprojects.com

Navigate

  • ABOUT
  • TESTIMONIALS
  • FIND A DEALER
  • CAREERS

CONTACT

  • CONTACT
  • FAQ
  • RESOURCES
  • EMAIL US

Useful links

  • REFUND & RETURN POLICY
  • PRIVACY POLICIES

Support

  • FACEBOOK
  • TWITTER
  • PINTEREST
  • GOOGLE PLUS
Copyright © 2026 MTech Projects. All Rights Reserved.